@Xiaomi: For the first time at IFA 2026, we're showcasing our latest in-house designed Xiaomi XRING chips, which will help power…
Summary
Xiaomi unveils its first in-house designed AI chips, the Xiaomi XRING O3, at IFA 2026, to be featured in the Xiaomi 18 Fold flagship device.
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Cached at: 09/03/26, 12:00 AM
For the first time at IFA 2026, we’re showcasing our latest in-house designed Xiaomi XRING chips, which will help power AI across Xiaomi’s complete ecosystem.
Xiaomi 18 Fold will be the first flagship product to feature our Xiaomi XRING O3 chip.
See both tomorrow, 10:30 https://t.co/B0Jpa2lpVp
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