Top chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change

Ars Technica News

Summary

Top chipmakers like Intel, Samsung, and TSMC are adopting ASML's advanced EUV machines and standardizing on 12-inch photomasks to improve chip production efficiency, driven by AI demand and geopolitical competition.

<p>Leading chipmakers <a href="https://www.asml.com/en/news/press-releases/2026/samsung-electronics-and-asml-expand-collaboration-on-next-generation-semiconductor-manufacturing">Samsung Electronics</a> and <a href="https://www.asml.com/en/news/press-releases/2026/tsmc-and-asml-announce-industry-transition-to-large-format-photomasks-for-high-na-euv">Taiwan Semiconductor Manufacturing Co.</a> announced plans to adopt ASML’s latest chipmaking machines in the next several years—and they also joined Intel in agreeing to a crucial technology change that could boost chip production on the new machines by 40 percent.</p> <p>This signifies the semiconductor industry’s broader embrace of high NA EUV photolithography technology that can cost up to $400 million per machine and is only provided by the Dutch technology company ASML, <a href="https://www.bloomberg.com/news/articles/2026-09-08/asml-tsmc-samsung-intel-back-12-inch-masks-for-ai-chips">Bloomberg reports</a>. The technology would allow chip designers to implement even smaller features in potentially more powerful and efficient next-generation chips produced for AI data centers and consumer electronics such as smartphones, tablets, and laptops.</p> <p>ASML’s EUV (extreme ultraviolet) lithography machines enable chipmakers to use powerful laser light to imprint patterns in silicon wafers, layer by layer, and gradually form the computer circuitry that makes silicon chips work. But improving such EUV technology has required finding more powerful sources of light with even shorter wavelengths capable of creating even smaller features on silicon wafers.</p><p><a href="https://arstechnica.com/gadgets/2026/09/top-chipmakers-embrace-asmls-400m-machines-agree-to-crucial-chipmaking-change/">Read full article</a></p> <p><a href="https://arstechnica.com/gadgets/2026/09/top-chipmakers-embrace-asmls-400m-machines-agree-to-crucial-chipmaking-change/#comments">Comments</a></p>
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# Top chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change Source: [https://arstechnica.com/gadgets/2026/09/top-chipmakers-embrace-asmls-400m-machines-agree-to-crucial-chipmaking-change/](https://arstechnica.com/gadgets/2026/09/top-chipmakers-embrace-asmls-400m-machines-agree-to-crucial-chipmaking-change/) Intel has already begun adopting high\-NA EUV machines in chip manufacturing\. The US company has[used the technology](https://www.asml.com/en/news/press-releases/2026/high-na-euv-reaches-new-readiness-milestone)in high\-volume manufacturing of Panther Lake processors for mobile computing devices starting in July 2026\. ## Industry moves on as China races to catch up Samsung and TSMC are also now working with Intel and ASML to change the chipmaking standard for photomasks—the stencils that provide the intricate circuitry patterns imprinted onto silicon—from 6\-inch photomasks to 12\-inch photomasks\. That shift could eventually improve the chipmaking productivity of high NA EUV machines by 40 percent, ASML chief technology officer Marco Pieters told Bloomberg\. The South Korean memory chipmaker SK Hynix is also considering joining the industry consortium overseeing the switch to the larger 12\-inch photomasks, a spokesperson told Bloomberg\. Like Samsung, SK Hynix is also aiming to start making memory chips using the high NA EUV technology starting in 2028\. Improved production of chips has become a business imperative for as long as the[AI bubble](https://arstechnica.com/gadgets/2026/06/how-to-burst-the-ai-bubble-strike-at-its-roots/)continues to inflate\. Tech companies’ rush to construct[new AI data centers](https://arstechnica.com/features/2026/09/the-ai-data-center-boom-is-causing-new-accountability-problems/)has also contributed to a[global shortage of memory chips](http://arstechnica.com/gadgets/2026/01/ram-shortage-chaos-expands-to-gpus-high-capacity-ssds-and-even-hard-drives/)that has[increased the prices of smartphones](https://arstechnica.com/gadgets/2026/07/apple-and-samsung-benefit-as-memory-shortage-pushes-smartphone-shipments-to-historic-lows/), laptops, and[gaming machines](https://arstechnica.com/gadgets/2026/02/valves-steam-deck-intermittently-out-of-stock-as-ram-shortage-drags-on/)\. Meanwhile, the importance of ASML machines for advanced chipmaking has also become a key issue in the ongoing[tech competition between the United States and China](https://arstechnica.com/tag/china/)\. ASML still supplies Chinese companies like Semiconductor Manufacturing International Corporation \(SMIC\) with older\-generation deep\-ultraviolet lithography machines but has been[blocked from exporting most of its chipmaking machines to China](https://www.theguardian.com/technology/2024/jan/02/asml-halts-hi-tech-chip-making-exports-to-china-reportedly-after-us-request)under Dutch government restrictions and US political pressure\. Despite unproven[US government allegations](https://www.bloomberg.com/news/articles/2026-06-19/us-tells-asml-it-s-concerned-china-may-have-top-chip-tool)that China managed to obtain one of ASML’s EUV lithography machines, Chinese companies[face an uphill battle](https://warontherocks.com/cogs-of-war/asmls-extreme-ultraviolet-lithography-and-the-limits-of-reverse-engineering-in-china/)in developing a homegrown version of the technology and the supply chain necessary to support production of such machines\. An executive at Germany’s Zeiss Group, the exclusive supplier of the mirrors and optical systems used in ASML machines, recently predicted that[China would need 15 years](https://www.bloomberg.com/news/articles/2026-09-02/asml-supplier-says-china-15-years-behind-in-top-chipmaking-tools)to develop EUV lithography machines\. *This story was updated on September 8, 2026, to correct the description of EUV technology in comparison with older technologies such as deep ultraviolet lithography\.*

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