@rohanpaul_ai: The U.S. is gaining SK hynix's first HBM packaging base in Indiana, a $4 B memory hub The Indiana site will receive Kor…
Summary
SK hynix is building its first high-bandwidth memory (HBM) packaging base in Indiana with a $4 billion investment, backed by US government funding under the CHIPS Act, with operations set to start by 2028-2029.
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The U.S. is gaining SK hynix’s first HBM packaging base in Indiana, a $4 B memory hub
The Indiana site will receive Korean-made wafers, package and test them, then ship finished HBM to U.S. customers.
a 133.5-acre site, will be SK Hynix’s first high-bandwidth memory packaging base in the US. Its cleanroom is expected to open by October 2028, with mass production of next-generation HBM scheduled to begin in the second half of 2029.
Washington is backing the build with up to $458M in grants and $500M in loans under the CHIPS Act.
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