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The author visited semiconductor exhibitions in Silicon Valley and Taiwan in the autumn of 2026, observing the intense competition in AI chips, the evolution of advanced packaging towards ultra-large sizes, the shift in the computing power market from shortage to potential surplus, and discussed new investment models for frontier AI research and the uncertainty in AI investment returns.
Intel is advancing chip packaging technologies like Foveros and EMIB to enable multi-chip packages for AI workloads, scaling beyond traditional reticle limits.
This article discusses the growing gap between laboratory tests and production reality for semiconductor materials, highlighting how complex interactions in advanced packaging and heterogeneous integration lead to unexpected failures.