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Researchers at the University of Illinois have demonstrated a scalable method to sequentially stack high-performance silicon circuits, achieving monolithic 3D integration within strict thermal budgets, which could extend Moore's Law beyond traditional transistor shrinking.
CXMT is aggressively expanding capacity. Its three 12-inch fabs now have a combined monthly capacity of nearly 300,000 wafers, accounting for close to 15% of global DRAM output. However, the localization rate of equipment is only about 45%, with heavy reliance on overseas suppliers in lithography, metrology and other areas, facing export control pressures such as the US MATCH Act.
President Trump recommends that chip manufacturers move their facilities to America, citing China's desire to take over Taiwan and the importance of chips for AI and technological advances. He claims the US could achieve 40-50% of world chip business by the end of his term.
Apple and Intel have reached a preliminary deal for Intel to manufacture chips for Apple, marking a significant partnership in the semiconductor industry.