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A memory tutorial at hot chips 2026 highlights the growing gap between compute performance and HBM bandwidth, with practical fixes being implemented, such as Samsung's LPDDR5x achieving 3.01x token speed on llama 3.1 8B.
An analysis of AI inference hardware, comparing Taalas and Groq's approaches to etching model weights into silicon, and noting recent investments by Nvidia and AMD.
The article deeply deconstructs how CXL technology breaks the AI memory wall, analyzes memory bottlenecks from training to inference stages, and the application prospects of CXL in data centers.