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Recommend an excellent video explaining high-bandwidth memory (HBM), from basic principles to engineering processes, with a comparison of the three major memory manufacturers.
This article uses an industry chain perspective to deeply analyze the key technologies, major players (SK Hynix, Samsung, Micron), and advanced packaging processes (CoWoS, CoPoS) of HBM (High Bandwidth Memory), and highlights related investment opportunities.
Memory costs have risen to 63% of AI chip component costs between 2024 and 2025, driven by HBM spending, according to analysis from Epoch AI. Total component spending on AI chips grew from $22 billion to $52 billion over the same period.
AI-driven demand for high-bandwidth memory (HBM) is constraining consumer RAM production, causing price increases for devices like cheap smartphones, especially in emerging markets.