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Marvell Technology agreed to acquire Lumentum in an all-stock deal valuing the optical-component maker at $115 billion, the year's largest M&A transaction and a bet that AI data centers will shift from copper to light-based interconnects. The combined company would compete directly with Broadcom, with closing expected in the first half of 2028.
Cerebras’ share price has halved in the five months since its IPO (falling from $311 to $109). The bulk of its $25.4 billion in orders comes from OpenAI, and the article examines concerns about its ability to deliver and the competition it faces, including Nvidia’s acquisition of Groq.
Seoul Viosys has begun mass production of WICOP 3, a rare-earth-free white light micro-LED chip as small as 10µm, eliminating the need for phosphor packaging and synthetic materials while cutting manufacturing costs by about half.
Micron is reportedly dropping its 4F² DRAM cell architecture while competitors push ahead with the technology, marking a notable shift in memory chip strategy.
Diamond Foundry details its all-diamond transistor platform that uses hydrogen-terminated surface transfer doping to create a two-dimensional hole gas (2DHG), avoiding ion implantation defects while preserving diamond's high thermal conductivity and breakdown strength for high-power and high-frequency electronics.
Samsung is converting its Xi'an NAND plant to 286-layer V9 chips under the "Monami" project, while SK Hynix seeks to upgrade its Dalian facility to 240+ layers, both reportedly in consultation with US export authorities despite Commerce Department restrictions on capacity and technology upgrades.
The paper proposes WaferHDC, an online open-world wafer defect discovery framework based on hyperdimensional computing that dynamically detects and groups recurring defect patterns without labels or retraining, outperforming the strongest online baseline by 13.3 p.p. in adjusted Rand index on the WM-811K dataset.
Michael Dell and Jensen Huang meet at Computex in Taiwan, reminiscing about the early PC industry and discussing engineering culture, Taiwan's semiconductor origins, and the opportunity for US reindustrialization through AI and manufacturing.
长鑫存储（CXMT）宣称在4F² DRAM定价上取得突破，引发三星、美光等海外存储厂商股价下跌，但长鑫自身股价近期反而走低，引发市场质疑。
An open-source beginner-friendly book, "Introduction to Semiconductor Manufacturing," walks a silicon wafer from sand through fab, testing, and packaging in 25 chapters, available in Traditional Chinese, English, Japanese, and Korean with glossaries and fab-floor know-how boxes.
Elon Musk comments on the ambition of the Terafab project, which aims to produce around 1 TW of AI compute annually — roughly 50× current global output — arguing that scale alone becomes a qualitative shift.
Volantis announced an $88M Series A to build optical interconnects that break the AI memory wall, promising orders-of-magnitude gains in memory bandwidth and capacity for ultra-fast inference of large models.
Micron's CEO warned that memory supply will be significantly tighter in 2027 and 2028 than in 2026, signaling continued constraints on DRAM/HBM availability driven by AI demand.
Nvidia could generate approximately $6.5 billion per quarter, or $26 billion annually, from RTX Pro 5500 chip sales to China, with shipments possibly starting in late December.
A tweet recommends the book 'A Brief History of Chips', which covers semiconductor history from Edison's filament to EUV, with the content allegedly created using the AI model Opus5.5.
CXMT claims its fifth-generation DRAM technology matches industry leaders Samsung and Micron, entering mass production while navigating US export controls.
Samsung Electronics is expected to more than double output of its HBM4 and HBM4E DRAM chips next year, with glass carrier demand rising 2.5 times, indicating significant production growth for high-bandwidth memory in response to AI and computing demands.
China's CXMT announces the mass production of its new memory-chip platform, marking a significant development in the semiconductor industry.
US chip manufacturers face a critical labor shortage, with up to 157,000 unfilled positions projected by 2030, as only 3% of US engineering graduates enter the semiconductor industry.
Huawei has accelerated the launch of its next-generation Ascend 960DT AI chip to Q1 2027, aiming to challenge Nvidia with improved performance and new computing systems amid US-China tech tensions.