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IBM has unveiled a new chip architecture called nanostack that vertically stacks transistors in two layers, enabling twice the transistor density of its previous technology. This breakthrough could extend Moore's Law for another decade and improve chip performance by 50% and energy efficiency by 70%.

Dutch Trade Minister Sjoerd Sjoerdsma visited Washington to lobby against the MATCH Act, which would ban sales of older-generation chipmaking equipment to China, threatening ASML's business.

Micron is thriving amid the AI-driven memory chip shortage, reporting record quarterly earnings and a strategic deal with Anthropic, while consumers face rising prices.

Qualcomm acquires chip startup Modular for nearly $4 billion to strengthen its AI software platform and expand beyond mobile chips into data centers and AI gadgets.

The article discusses a sell-off in AI-related tech stocks, raising doubts about whether the massive spending on artificial intelligence will yield returns. It highlights market volatility, with major companies like Micron, Nvidia, and Alphabet experiencing significant drops.

Presents a machine learning framework using an autoencoder for efficient modeling of FinFET devices, achieving high accuracy with minimal training data.

At least seven Chinese companies are shipping H100/H200-class AI accelerators, most having recently IPO'd, with several founded by former NVIDIA/AMD architects. Huawei's Ascend 950 targets H200-class performance, and China's domestic market share is rising as NVIDIA's declines.

Micron stock surged 6.8% to an all-time high of $1,211.38 after signing a memory supply deal with AI lab Anthropic, driven by AI demand for high-bandwidth memory. Analysts have raised price targets but view $3,000 as a long shot.

This newsletter highlights ASML's $400 million chipmaking machine critical for AI-era chips and Anthropic's feud with the US government over export controls on its Mythos AI model.

ASML is shipping its new $400 million high-NA EUV lithography machine, which can pattern features as small as 8 nanometers, crucial for advancing Moore's Law and meeting AI industry demand for denser, more powerful chips.

Collected multiple Chinese web pages for tracking AI supply chain analyst Serenity (White Hair Stock God), providing Chinese-English bilingual translation, stock tracking, and research dashboard tools, and also mentions the South Korea stock market circuit breaker event.

SK hynix is delaying the transition of some HBM3E production lines to HBM4 in order to increase general-purpose DRAM output, which currently offers higher operating profit margins.

Recommend an excellent video explaining high-bandwidth memory (HBM), from basic principles to engineering processes, with a comparison of the three major memory manufacturers.

Samsung demonstrates the first 3D Stacked FETs with triple nanosheet channels at a 42nm gate pitch, presented at the 2026 VLSI Symposium, achieving a high review score and highlighting a new vertical transistor architecture for advanced logic scaling.

US officials claim ASML's EUV lithography machine may have ended up in China, which would breach export controls; ASML denies this, stating no such machine is in China and that all units are tracked.

This article uses an industry chain perspective to deeply analyze the key technologies, major players (SK Hynix, Samsung, Micron), and advanced packaging processes (CoWoS, CoPoS) of HBM (High Bandwidth Memory), and highlights related investment opportunities.

Bernstein research report predicts that the era of Agentic AI will drive a reversal of CPU roles in data centers, with the server CPU addressable market possibly reaching $223 billion by 2030, favoring stocks such as Haiguang Information and Arm.

Nvidia plans to raise over $25B in its first bond deal since 2021, reflecting market fatigue and the company's deep involvement in AI ecosystem financing, which has raised concerns about circular risks among investors.

AT&S, an Austrian printed circuit board manufacturer, announces a €2 billion investment in a new facility in Malaysia to expand its production capacity and capitalize on the growing demand driven by the AI boom.

This article deeply analyzes the early career of AMD CEO Lisa Su, focusing on her choices at MIT and IBM to research hardcore technical problems such as SOI and copper interconnects, and actively supplementing her business judgment, emphasizing her judgment to pick hard, specific, and deliverable problems rather than chasing trends.