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ASML, the world's only supplier of EUV lithography systems, reported selling nothing in Europe in 2026, a decline from previous years, and is urging the EU to help create demand for European chips.
CXMT claims its fifth-generation DRAM technology matches industry leaders Samsung and Micron, entering mass production while navigating US export controls.
US chip manufacturers face a critical labor shortage, with up to 157,000 unfilled positions projected by 2030, as only 3% of US engineering graduates enter the semiconductor industry.
Memory now accounts for 63% of AI accelerator costs, up from 52% in early 2024, shifting industry priorities toward data movement optimization over process shrinks.
Arizona's dwindling water supply from the Colorado River is jeopardizing the expansion of chip manufacturing for AI, affecting companies like TSMC and Intel as they scale production amid drought conditions.
Kepler Compute announces its launch after 7 years in stealth, raising $468M to develop advanced AI memory chips that aim to break the compute scarcity by bypassing EUV lithography and using 3D innovations for higher bandwidth and capacity.
A tweet outlines Elon Musk's vision of building a massive Terafab chip manufacturing facility to power AI, robotics, and automation, turning AI into physical infrastructure that could reshape the 2030s.
Tesla announced that its Terafab chip manufacturing facility will be built in Grimes County, Texas, aiming to produce over 1 terawatt of compute per year to meet the chip demands of Tesla and SpaceX.
An animated, Rollercoaster Tycoon-inspired interactive visualization explains the chip manufacturing process by following a wafer through each stage of production.
The article highlights how Ajinomoto's obscure build-up film (ABF) is a critical, near-monopoly component in AI chips, and critiques the UK government's £1.1 billion AI Hardware Plan for focusing on compute and design while ignoring such concentrated supply-chain bottlenecks.
South Korea has announced an $880 billion AI infrastructure plan covering semiconductor expansion, physical AI, and AI data centers, aiming to strengthen its position in the global AI race. The multi-year plan involves major companies and includes building four new fabs and 18.4GW of data center capacity.
TSMC CFO says the company is accelerating its Arizona factory build-out with an additional $100 billion investment to meet surging AI-driven demand, raising total U.S. investment to $265 billion.
Chinese startup Yuanjiwei has launched the world's first 8-inch pilot production line for 2D semiconductors, potentially enabling advanced chip manufacturing without EUV lithography, addressing scaling challenges of 2D materials from lab to industry.
German semiconductor giant Infineon opened a €5 billion chip plant in Dresden, supported by the EU Chips Act, aiming to reduce European dependency on Asian and US chip production and bolster tech autonomy, with a focus on AI and green energy applications.
Google is in talks with Samsung to manufacture a component of its next-generation AI chip, codenamed Icefish, using 2-nanometer technology, while the main part will be made by TSMC. The chip aims to offer an alternative to Nvidia's GPUs and is expected to enter mass production as soon as 2028.
C12 unveils Pick & Place, a patented nanoassembly process that precisely positions carbon nanotubes on quantum chips, dramatically increasing manufacturing throughput—50 devices assembled in four weeks versus one year previously—and enabling scalable multi-qubit integration.
TSMC CEO C.C. Wei warned that the company is struggling to meet surging AI-driven chip demand, stating it could take a 'very long time' to fulfill customer needs even with its US factory expansion, including a $165 billion investment in new American plants.
This article traces the history of Dutch computing from the first computer in 1952 to ASML, highlighting the role of people like Edsger Dijkstra and the connection between academic thinking and industrial making.
Researchers at the University of Illinois have demonstrated a scalable method to sequentially stack high-performance silicon circuits, achieving monolithic 3D integration within strict thermal budgets, which could extend Moore's Law beyond traditional transistor shrinking.
CXMT is aggressively expanding capacity. Its three 12-inch fabs now have a combined monthly capacity of nearly 300,000 wafers, accounting for close to 15% of global DRAM output. However, the localization rate of equipment is only about 45%, with heavy reliance on overseas suppliers in lithography, metrology and other areas, facing export control pressures such as the US MATCH Act.